|Products Size:||2.65mm×2.65mm×2.00mm||Life Time:||5000hours|
|Protect:||ESD||Package:||Quartz Glass Package|
|Degree:||60°||Radiant Flux Power:||1600-2000mw|
385nm UV LED Chip,
ROHS UV LED Chip,
2525 led chip
2525 size U325A2V106Z1 385nm 60 degree uv led chip
Characteristics of UV LED:
|Spectrum Half Width||Δλ||nm||10|
Absolute Maximum Ratings:
|Maximum RatingForward Current||IFmax||mA||1000|
|Peak Forward Current||IFp||mA||1200|
|Maximum Rating Junction Temperature||Tjmax||°C||125|
|Operating Temperature Range||Topr||°C||-30 ~ +85|
|Storage Temperature Range||Tstg||°C||-40 ~ +85|
● UV curing
● Fluorescence spectrum analysis
● Air purification
*This LED is designed to be reflow soldered on to a PCB. If dip soldered or hand soldered,Bytech cannot guarantee its reliability.
*Reflow soldering must not be performed more than twice.
*Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.
*Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation,caused by heat and/or atmosphere.
*Since the glass used in the encapsulating glass is fragile, do not press on the encapsulant glass.
pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and wire breaks, decreasing reliability
*Repairing should not be done after the LEDs have been soldered.
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
*The Die Heat Sink should be soldered to customer PCB. If it is difficult or impossible, use high heat-dissipating adhesive.
*When soldering, do not apply stress to the LED while the LED is hot.
*When using a pick and place machine, choose an appropriate nozzle for this product.
*When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner
Where the flux will come in contact with the LEDs.
*Make sure that there are no issues with the type and amount of solder that is being used.
Contact Person: Helen Yang