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Product Details:
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| Wavelength: | 380-390nm | Product ID: | U325A2V106Z1 |
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| Products Size: | 2.65mm×2.65mm×2.00mm | Life Time: | 5000hours |
| Protect: | ESD | Package: | Quartz Glass Package |
| Degree: | 60° | Radiant Flux Power: | 1600-2000mw |
| High Light: | 385nm UV LED Chip,ROHS UV LED Chip,2525 led chip |
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2525 size U325A2V106Z1 385nm 60 degree uv led chip
Characteristics of UV LED:
| Parameter | Symbol | Units | U325A2V106Z1 (IF=1000mA) |
| Peak Wavelength | λp | nm | 380-390 |
| Radiant flux | Φe | mw | 1600-2000 |
| Forward Voltage | vf | v | 3.5-4.0 |
| Thermal Resistance | Rth | °C/W | ≤3 |
| Spectrum Half Width | Δλ | nm | 10 |
| View Angle | 2θ1/2 | deg | 60 |
Absolute Maximum Ratings:
| Parameter | Symbol | Units | U325A2V106Z1 |
| Maximum RatingForward Current | IFmax | mA | 1000 |
| Peak Forward Current | IFp | mA | 1200 |
| Maximum Rating Junction Temperature | Tjmax | °C | 125 |
| Operating Temperature Range | Topr | °C | -30 ~ +85 |
| Storage Temperature Range | Tstg | °C | -40 ~ +85 |
Applications:
● UV curing
● Fluorescence spectrum analysis
● Air purification
Notes:
*This LED is designed to be reflow soldered on to a PCB. If dip soldered or hand soldered,Bytech cannot guarantee its reliability.
*Reflow soldering must not be performed more than twice.
*Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.
*Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation,caused by heat and/or atmosphere.
*Since the glass used in the encapsulating glass is fragile, do not press on the encapsulant glass.
pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and wire breaks, decreasing reliability
*Repairing should not be done after the LEDs have been soldered.
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
*The Die Heat Sink should be soldered to customer PCB. If it is difficult or impossible, use high heat-dissipating adhesive.
*When soldering, do not apply stress to the LED while the LED is hot.
*When using a pick and place machine, choose an appropriate nozzle for this product.
*When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner
Where the flux will come in contact with the LEDs.
*Make sure that there are no issues with the type and amount of solder that is being used.
Contact Person: Helen Yang
Tel: +86-13590418367
