385nm 3535 Sanan 45mil 12v LED Chip Diode For Ink Jet Printer

Name: 385nm 3535 Sanan 45mil 12v LED Chip Diode For Ink Jet Printer
Brand: BYTECH
SKU: CMH235A2V106Z1
Price: 1 USD
Availability: InStock
Rating: 4.8 (159 reviews)

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385nm 3535 Sanan 45mil 12v LED Chip Diode For Ink Jet Printer

Large Image : 385nm 3535 Sanan 45mil 12v LED Chip Diode For Ink Jet Printer

Product Details:

Place of Origin:	Guangzhou,China
Brand Name:	BYTECH
Certification:	ROHS
Model Number:	CMH235A2V106Z1

Payment & Shipping Terms:

Packaging Details:	45x40x25cm for 3 rolls, 2K pcs/one roll.
Delivery Time:	5-8 work days
Payment Terms:	T/T, Western Union, MoneyGram
Supply Ability:	100k/month

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385nm 3535 Sanan 45mil 12v LED Chip Diode For Ink Jet Printer

Description

Products Name::	UV LED	Emitting Color:	Purple,Ultraviolet
Chip Material:	InGaN	Viewing Angle(°):	60
Luminous Flux(lm):	1400-1800MW	Forward Voltage:	3.5-4.0v
Wavelength:	380-390nm	Application:	Fluorescent Spectroscopy;Bio-analysis/detection;Phototherapy;CuringPrinting;Coating.
High Light:	385nm 12v LED Chip , 3535 12v LED Chip , 45mil led diode chip

385nm 3535 size Sanan 45mil chips uv led diode for ink-jet printer

Characteristics of UV LED:

Parameter	Symbol	Units	CMH235A2V106Z1
Peak Wavelength [1]	λp	nm	380~390
Radiant Flux [2]	Φe	mW	1400~1800
Inverse voltage [3]	Vr	V	5
Forward Voltage [4]	Vf	V	3.5~4.0
Thermal Resistance [5]	Rth	°C/W	5
Spectrum Half Width	Δλ	nm	12
View Angle	2θ1/2	deg	60

Notes:

[1]. Peak wavelength measurement tolerance:±3nm;

[2]. Radiant flux measurement tolerance:±10%;

[3]. Φe is the total radiant Flux as measured with an integrated sphere;

[4]. Forward voltage measurement tolerance:±3%;

[5]. Rth is the thermal resistance between junction to substrate.

Feature:

● CMH: packaging technology;
● 2: viewing angle, 60°;
● 35: package size,3.5mm*3.5mm;
● A2: peak wavelength,380~390nm;
● V106: LED chip code, vertical chip;
● Z1: zener chip code;

Notes:

* This LED is designed to be reflow soldered on to a PCB. If dip soldered or hand soldered,Bytech cannot guarantee its reliability.

* Reflow soldering must not be performed more than twice.

* Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.

* Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation, caused by heat and/or atmosphere.

* Since the glass used in the encapsulating glass is fragile, do not press on the encapsulant glass.Pressure can cause nicks, chip-outs,

encapsulant delamination and deformation, and wire breaks,decreasing reliability

* Repairing should not be done after the LEDs have been soldered. It should be confirmed before hand whether the characteristics of the LEDs

will or will not be damaged by repairing.

* The Die Heat Sink should be soldered to customer PCB. If it is difficult or impossible, use high heat-dissipating adhesive.

* When soldering, do not apply stress to the LED while the LED is hot.

* When using a pick and place machine, choose an appropriate nozzle for this product.

* When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner Where the flux will come

in contact with the LEDs.

* Make sure that there are no issues with the type and amount of solder that is being used.

Circuit:

Tag:

Contact Person: Helen Yang

Tel: +86-13590418367

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